Attachments

Thermally conductive adhesive tape

All of our standard series heat sinks can be ordered with pre-applied thermally conductive adhesive tapes.

Simple and Easy attachment

Low cost

Push Pin with Spring

The Heat Sink is attached to the board by using push pins. The spring load applies appropriate pressure to the chip.

We can provide the total design, including springs, pushpins and thermal interface material

Applies appropriate compressive load to BGA solder balls instead of tension or shear

Superior thermal performance, a Phase Change Material or thermal grease can be used as the thermal interface material

Re-workable

Shoulder Screw with Spring

The Heat Sink is attached to the board with shoulder screws. The spring load applies the appropriate pressure to the chip. Several standard sizes of screws are available. We can provide the total design, including springs, screws and thermal interface material

• Applies appropriate compressive load to BGA solder balls instead of tension or shear
• Superior thermal performance, a Phase Change Material or thermal grease can be used as the thermal interface material
• Re-workable

Z-shaped clip with Anchor

Heat Sink is secured to the PCB by Z-shaped clip and anchors. The anchors are mechanically mounted to the PCB by snap-in or soldering. We offer multiple standard Z-shaped clips and anchors to accommodate various board layouts and PCB thicknesses. We can provide a complete assembly, including the heat sink, Z-Clip, and thermal interface material. The anchors are mounted separately at the board level.

• Superior thermal performance, a Phase Change Material or thermal grease can be used.
• Re-workable

Screws

In situations where relatively massive heat sinks are used, additional mounting methods may be required. This can include the use of backing plates or standoffs to act as attachment points for screws. Please contact our support personnel regarding the use of such items and the corresponding hardware.